3M ? Thermally Conductive Adhesive Transfer Tapes
8805 ? 8810 ? 8815 ? 8820
Application Guidelines (continued)
5.) Application Tips:
? For rigid to rigid bonding, a twisting motion during assembly of the substrates will improve wetting. This should be a
back and forth twisting motion during the application of compression.
? For flexible to rigid or flexible to flexible bonding, a roll lamination system may be employed to apply the flexible
substrate down to the rigid (or other flexible) substrate. Rubber nip rollers, heated steel rollers, and other methods can
be employed to bond in a continuous manner.
? Heat can be employed to increase wetting percentage and wetting rate of the substrates and to build room temperature
bond strength.
? Primers may be employed to increase adhesion to low surface energy substrates (eg. plastic packages). Contact your
3M Technical Service Representative for more information about primers.
? For best product performance, it is important to use pressure and time conditions to achieve as much wetting as
possible.
6.) Rework Tips:
? Rework requires separation of the two substrates. Separation can be accomplished by any practical means: prying,
torquing or peeling. The tape will be destroyed upon separation and must be replaced. The surfaces should be re-
cleaned according to the recommendations in this data page.
? Heating up the substrates can reduce the adhesion level and make removal easier.
? Part separation can be aided by immersion in warm water. This should eventually reduce the adhesion and make
prying, torquing or peeling apart the substrates easier.
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